by Michael Santo — Wednesday, September 12, 2007

Super Talent Unveils Project X DDR3 Kits

Super Talent Unveils Project X DDR3 Kits

The World's most Advanced DDR3 Memory

San Jose, California - September 12, 2007 -- Super Talent Technology, a leading manufacturer of DRAM memory modules and flash storage solutions, today announced immediate availability of the world's most advanced DDR3 memory kits, dubbed Project X.

Project X represents the most advanced DDR3 memory available. It is developed in Super Talent's Silicon Valley Engineering Labs to deliver the highest attainable DDR3 memory performance. Project X memory combines blistering fast clock speeds with aggressively tuned latencies.

Project X employs an extreme cooling solution that offers double the surface area and 106% more aluminum mass than standard heat spreaders. With Super Talent's special thermal adhesive, this cooling solution provides superior heat dissipation that results in a cooler, faster memory device.

These two Project X Kits are built with the fastest available, carefully screened DRAM chips, and are hand tested as a matched pair on a dual channel Asus P5K3 Deluxe motherboard...

Tags:  DDR, Super Talent, DDR3, super, talent, ECT, kit, pro, TAL, unveil, project, K
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