Items tagged with 3D TSV
Samsung today said it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) chip packaging technology, calling it "one of the most challenging packaging technologies for mass production of high performance chips." And that is precisely what it will be used for—it will enable Samsung to mass produce...
Read more...
Samsung Electronics has announced the creation of a new 32GB RDIMM with 3D TSV technology. The RDIMM (registered dual inline memory module) was made by stacking DDR3 SDRAMs that were manufactured by using 30nm-class process technology, and those SDRAMs were connected using the TSV (through silicon via) technology. This new module can provide...
Read more...
