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by Marco Chiappetta - Wed, Dec 12, 2018
Intel Foveros To Usher In Industry First 3D Stacked System On A Chip Designs
Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to the technical disclosures divulged to an exclusive group of attendees, Intel also talked about a shift in the... Read more...
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