Items tagged with powervia
Intel's upcoming RibbonFET technology is set to debut in the company's 20A node next year, but already the chip maker is showcasing the next step: 3D stacked CMOS (complementary metal oxide semiconductor) transistors. Though Intel had filed a patent for such a technology nearly two years ago, it was only in May at ITF...
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Microprocessors are the most complex things humans have ever constructed. In any complex system, radically changing one part of a system always has knock-on effects for other parts of the system. To combat this, you can try to de-couple interconnected parts of the system, and that's been a popular idea in...
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The ‘Intel Accelerated' webcast kicked off today, hosted by newly-minted CEO Pat Gelsinger and Dr. Ann Kelleher, SVP and general manager of Technology Development. The dynamic duo disclosed a number of new and interesting details regarding the company’s IDM 2.0 strategy along with Intel’s process and packaging...
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