JEDEC Updates High Bandwidth Memory (HBM) Standard To 24GB Per Stack At Blistering 307GBps
JEDEC announced an update to the the JESD235 memory standard that deals with the second generation of high bandwidth memory (HBM). This update brings two key feature enhancements to the standard. First, it raises the capacity limit for each device to 24GB, and it also raises the speed threshold to 307GB/s.
Equally as important is the increase in capacity, which has been an ongoing problem for companies implementing HBM designs. HBM memory chips are organized into four groups with memory chips stacked on top of each other. This has limited the total capacity of HBM over the years, and the original HBM standard maxed out at 4GB. HBM2 improved this by enabling stacks of up to eight memory modules, which pushed the limit up to 8GB. AMD's has been making the most of this technology, and the company's
The new JEDEC JESD235B standard will now make it possible for AMD to push the amount of RAM up on its graphics cards further, giving it an even footing to compete with NVIDIA on memory capacity. It will likely be sometime before we see new products that use this updated memory standard appear on the market though.